OptiStruct is a proven, modern structural solver with comprehensive, accurate and scalable solutions for linear and nonlinear
analyses across statics and dynamics, vibrations, acoustics, fatigue, heat transfer, and multiphysics disciplines.
This tutorial demonstrates the creation of finite elements on a given CAD geometry of a plate with a hole. Further,
application of boundary conditions and a finite element analysis of the problem are explained. Post-processing tools
are used in HyperView to determine deformation and stress characteristics of the loaded plate.
In this tutorial, an existing finite element model of a plastic coffee pot lid demonstrates how to apply constraints
and perform an OptiStruct finite element analysis. HyperView post-processing tools are used to determine deformation and stress characteristics of the lid.
In this tutorial, an existing finite element model of an automotive splash shield is used to demonstrate how to set up
and perform a normal modes analysis. HyperView post-processing tools are used to determine mode shapes of the model.
An existing finite element model is used in this tutorial to demonstrate how HyperMesh may be used to set-up an inertia relief analysis. The analysis is then performed using OptiStruct and post-processed in HyperView.
In this tutorial, an existing finite element model of a simple cantilever beam is used to demonstrate how to connect
dissimilar meshes using CWELD elements.
This tutorial takes you through the process of developing a ply lay-up definition for a composite structure using a PCOMPG card, and shows the advantages of post-processing the results with global ply numbers. The traditional definition method,
using PCOMP, is introduced first here to ultimately show the practical advantages of using PCOMPG for the given scenario.
This tutorial outlines the procedure to perform a linear transient heat transfer analysis on a steel extended-surface
heat transfer fin attached to the outer surface of a system generating heat flux (Example: IC engine).
Printed Circuit Boards (PCB's) are used in electronic components to both mechanically
support and provide electrical connections between components. Construction involves
etching a thin copper layer that has been deposited onto a non-conductive, glass-fiber/epoxy
composite substrate. Electrical components are then mounted to the board and
connected to the copper traces with electrical solder.
In this tutorial, you continue to gain an understanding of the basic concepts for creating a OptiStruct input file. More specifically, learn how to set up a model for modal analysis, specify solver specific controls and
also submit an input file to the solver from HyperMesh.
This section presents nonlinear explicit analysis examples generated using OptiStruct. Each example uses a problem description, execution procedures, and results to demonstrate how OptiStruct is used.
The OptiStruct Example Guide is a collection of solved examples for various solution sequences and optimization types and provides
you with examples of the real-world applications and capabilities of OptiStruct.
OS-T: 1000 Linear Static Analysis of a Plate with a Hole
This tutorial demonstrates the creation of finite elements on a given CAD geometry of a plate with a hole. Further, application of boundary conditions and a finite element analysis of the problem are explained. Post-processing tools are used in HyperView to determine deformation and stress characteristics of the loaded plate.
OS-T: 1010 Thermal Stress Analysis of a Coffee Pot Lid
In this tutorial, an existing finite element model of a plastic coffee pot lid demonstrates how to apply constraints and perform an OptiStruct finite element analysis. HyperView post-processing tools are used to determine deformation and stress characteristics of the lid.
OS-T: 1020 Normal Modes Analysis of a Splash Shield
In this tutorial, an existing finite element model of an automotive splash shield is used to demonstrate how to set up and perform a normal modes analysis. HyperView post-processing tools are used to determine mode shapes of the model.
OS-T: 1030 3D Inertia Relief Analysis
An existing finite element model is used in this tutorial to demonstrate how HyperMesh may be used to set-up an inertia relief analysis. The analysis is then performed using OptiStruct and post-processed in HyperView.
OS-T: 1040 3D Buckling Analysis
In this tutorial the steps required to perform a buckling analysis using OptiStruct are covered.
OS-T: 1060 Analysis of a Composite Aircraft Structure using PCOMPG
This tutorial takes you through the process of developing a ply lay-up definition for a composite structure using a PCOMPG card, and shows the advantages of post-processing the results with global ply numbers. The traditional definition method, using PCOMP, is introduced first here to ultimately show the practical advantages of using PCOMPG for the given scenario.
OS-T: 1100 Thermal Stress Analysis of a Printed Circuit Board with Anisotropic Material Properties
Printed Circuit Boards (PCB's) are used in electronic components to both mechanically support and provide electrical connections between components. Construction involves etching a thin copper layer that has been deposited onto a non-conductive, glass-fiber/epoxy composite substrate. Electrical components are then mounted to the board and connected to the copper traces with electrical solder.
OS-T: 1110 Modal Analysis Setup
In this tutorial, you continue to gain an understanding of the basic concepts for creating a OptiStruct input file. More specifically, learn how to set up a model for modal analysis, specify solver specific controls and also submit an input file to the solver from HyperMesh.